HSB12-272706
| Manufacturer Part Number | HSB12-272706 |
|---|---|
| Manufacturer | CUI Devices |
| Detailed Description | HEAT SINK, BGA, 27 X 27 X 6 MM |
| Package | Box |
| In Stock | 165693 pcs |
| Data sheet |
Reference Price (In US Dollars)
| 1 | 10 | 25 | 50 | 100 | 250 | 500 | 1000 | 5000 |
|---|---|---|---|---|---|---|---|---|
| $0.357 | $0.338 | $0.322 | $0.313 | $0.309 | $0.288 | $0.271 | $0.245 | $0.237 |
Delivery Time
Components-House.com is a Reliable Stocking Distributor of Electronic Parts. We specialize in all CUI Devices series electronic components. We have 165693 pieces of CUI Devices HSB12-272706 in stock available now. Request a quote from electronics components distributor at Components-House.com, our sales team will contact you within 24 hours.
RFQ Email: info@Components-House.net
RFQ Email: info@Components-House.net
Specifications
| Product Attribute | Attribute Value |
|---|---|
| Width | 1.063" (27.00mm) |
| Type | Top Mount |
| Thermal Resistance @ Natural | 19.59°C/W |
| Thermal Resistance @ Forced Air Flow | 7.80°C/W @ 200 LFM |
| Shape | Square, Pin Fins |
| Series | HSB |
| Power Dissipation @ Temperature Rise | 3.8W @ 75°C |
| Package Cooled | BGA |
| Product Attribute | Attribute Value |
|---|---|
| Package | Box |
| Material Finish | Black Anodized |
| Material | Aluminum Alloy |
| Length | 1.063" (27.00mm) |
| Fin Height | 0.236" (6.00mm) |
| Diameter | - |
| Attachment Method | Adhesive |
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