Welcome to Components-House.com
Privacy Policy Contact Us
RFQs/Order

Select Language

Current Language: English
Home > Products > Fans, Thermal Management > Thermal - Heat Sinks > HSB08-212106
HSB08-212106 Image
Image may be representation.
See specs for product details.

HSB08-212106

Manufacturer Part Number HSB08-212106
Manufacturer CUI Devices
Detailed Description HEAT SINK, BGA, 21 X 21 X 6 MM
Package Box
In Stock 188082 pcs
Data sheet HSB08-212106HSB08-212106
Reference Price (In US Dollars)
1 10 25 50 100 250 500 1000 5000
$0.355 $0.336 $0.32 $0.311 $0.307 $0.286 $0.269 $0.244 $0.236
Delivery Time Components-House.com is a Reliable Stocking Distributor of Electronic Parts. We specialize in all CUI Devices series electronic components. We have 188082 pieces of CUI Devices HSB08-212106 in stock available now. Request a quote from electronics components distributor at Components-House.com, our sales team will contact you within 24 hours.
RFQ Email: info@Components-House.net
Request a quote Submit a Request For Quotation on quantities greater than those
displayed.

Specifications

Product Attribute Attribute Value
Width 0.827" (21.00mm)
Type Top Mount
Thermal Resistance @ Natural 25.40°C/W
Thermal Resistance @ Forced Air Flow 9.70°C/W @ 200 LFM
Shape Square, Pin Fins
Series HSB
Power Dissipation @ Temperature Rise 3.0W @ 75°C
Package Cooled BGA
Product Attribute Attribute Value
Package Box
Material Finish Black Anodized
Material Aluminum Alloy
Length 0.827" (21.00mm)
Fin Height 0.236" (6.00mm)
Diameter -
Attachment Method Adhesive

Recommended Products

HSB08-212106 Datasheet PDF

Data sheet

Related keywords for HSB08-212106

Related parts for HSB08-212106