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Home > Products > Fans, Thermal Management > Thermal - Heat Sinks > HSB10-232306
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HSB10-232306

Manufacturer Part Number HSB10-232306
Manufacturer CUI Devices
Detailed Description HEAT SINK, BGA, 23 X 23 X 6 MM
Package Box
In Stock 231717 pcs
Data sheet HSB10-232306HSB10-232306
Reference Price (In US Dollars)
1 10 25 50 100 250 500 1000 5000
$0.294 $0.278 $0.264 $0.257 $0.254 $0.236 $0.223 $0.202 $0.195
Delivery Time Components-House.com is a Reliable Stocking Distributor of Electronic Parts. We specialize in all CUI Devices series electronic components. We have 231717 pieces of CUI Devices HSB10-232306 in stock available now. Request a quote from electronics components distributor at Components-House.com, our sales team will contact you within 24 hours.
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Specifications

Product Attribute Attribute Value
Width 0.906" (23.00mm)
Type Top Mount
Thermal Resistance @ Natural 25.46°C/W
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 200 LFM
Shape Square, Pin Fins
Series HSB
Power Dissipation @ Temperature Rise 3.0W @ 75°C
Package Cooled BGA
Product Attribute Attribute Value
Package Box
Material Finish Black Anodized
Material Aluminum Alloy
Length 0.906" (23.00mm)
Fin Height 0.236" (6.00mm)
Diameter -
Attachment Method Adhesive

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HSB10-232306 Datasheet PDF

Data sheet

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