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Home > Products > Fans, Thermal Management > Thermal - Heat Sinks > HSB05-171711
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HSB05-171711

Manufacturer Part Number HSB05-171711
Manufacturer CUI Devices
Detailed Description HEAT SINK, BGA, 17 X 17 X 11.5 M
Package Box
In Stock 149340 pcs
Data sheet HSB05-171711
Reference Price (In US Dollars)
1 10 25 50 100 250 500 1000 5000
$0.403 $0.383 $0.373 $0.363 $0.342 $0.322 $0.302 $0.282 $0.272
Delivery Time Components-House.com is a Reliable Stocking Distributor of Electronic Parts. We specialize in all CUI Devices series electronic components. We have 149340 pieces of CUI Devices HSB05-171711 in stock available now. Request a quote from electronics components distributor at Components-House.com, our sales team will contact you within 24 hours.
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Specifications

Product Attribute Attribute Value
Width 0.669" (17.00mm)
Type Top Mount
Thermal Resistance @ Natural 23.91°C/W
Thermal Resistance @ Forced Air Flow 8.40°C/W @ 200 LFM
Shape Square, Pin Fins
Series HSB
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Package Cooled BGA
Product Attribute Attribute Value
Package Box
Material Finish Black Anodized
Material Aluminum Alloy
Length 0.669" (17.00mm)
Fin Height 0.453" (11.50mm)
Diameter -
Attachment Method Adhesive

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HSB05-171711 Datasheet PDF

Data sheet

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