Delivery Time
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Specifications
Product Attribute
Attribute Value
Width
1.410" (35.81mm)
Type
Top Mount
Thermal Resistance @ Natural
16.20°C/W
Thermal Resistance @ Forced Air Flow
5.60°C/W @ 400 LFM
Shelf Life
24 Months
Shape
Square, Pin Fins
Series
BDN
Power Dissipation @ Temperature Rise
-
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Product Attribute
Attribute Value
Package
Box
Material Finish
Black Anodized
Material
Aluminum
Length
1.410" (35.81mm)
Fin Height
0.355" (9.02mm)
Diameter
-
Base Product Number
BDN14
Attachment Method
Thermal Tape, Adhesive (Included)
Recommended Products
BDN13-3CB/A01HEATSINK CPU W/ADHESIVE 1.31"SQCTS Thermal Management Products