Delivery Time
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Specifications
Product Attribute
Attribute Value
Width
1.210" (30.73mm)
Type
Top Mount
Thermal Resistance @ Natural
19.60°C/W
Thermal Resistance @ Forced Air Flow
6.80°C/W @ 400 LFM
Shelf Life
24 Months
Shape
Square, Pin Fins
Series
BDN
Power Dissipation @ Temperature Rise
-
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Product Attribute
Attribute Value
Package
Tray
Material Finish
Black Anodized
Material
Aluminum
Length
1.210" (30.73mm)
Fin Height
0.355" (9.02mm)
Diameter
-
Base Product Number
BDN12
Attachment Method
Thermal Tape, Adhesive (Included)
Recommended Products
BDN15-3CB/A01HEATSINK CPU W/ADHESIVE 1.51"SQCTS Thermal Management Products