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Specifications
Product Attribute
Attribute Value
Type
DIP, 0.3' (7.62mm) Row Spacing
Termination Post Length
0.059' (1.50mm)
Termination
Solder
Series
BU-178HT
Pitch - Post
0.100' (2.54mm)
Pitch - Mating
0.100' (2.54mm)
Package
Tube
Operating Temperature
-55°C ~ 125°C
Number of Positions or Pins (Grid)
14 (2 x 7)
Mounting Type
Surface Mount
Material Flammability Rating
UL94 V-0
Product Attribute
Attribute Value
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Features
Open Frame
Current Rating (Amps)
1 A
Contact Resistance
7mOhm
Contact Material - Post
Brass
Contact Material - Mating
Beryllium Copper
Contact Finish Thickness - Post
Flash
Contact Finish Thickness - Mating
78.7µin (2.00µm)
Contact Finish - Post
Copper
Contact Finish - Mating
Gold
Base Product Number
BU14OZ
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BU140Z-178-HTCONN IC DIP SOCKET 14POS GOLDOn-Shore Technology, Inc.