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Home > Products > Soldering, Desoldering, Rework Products > Solder Stencils, Templates > BGA0034-S

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BGA0034-S

Manufacturer Part Number	BGA0034-S
Manufacturer	Chip Quik Inc.
Detailed Description	BGA-676 (1.0 MM PITCH, 26 X 26 G
Package	Bulk
In Stock	5665 pcs
Data sheet	BGA0034-S

Reference Price (In US Dollars)

1
$7.858

Delivery Time Components-House.com is a Reliable Stocking Distributor of Electronic Parts. We specialize in all Chip Quik Inc. series electronic components. We have 5665 pieces of Chip Quik Inc. BGA0034-S in stock available now. Request a quote from electronics components distributor at Components-House.com, our sales team will contact you within 24 hours.
RFQ Email: info@Components-House.net

Specifications

Product Attribute	Attribute Value
Type	BGA
Thickness	0.0040" (0.102mm)
Thermal Center Pad	-
Series	Proto-Advantage BGA
Pitch	0.039" (1.00mm)

Product Attribute	Attribute Value
Package	Bulk
Outer Dimension	2.600" L x 1.800" W (66.04mm x 45.72mm)
Number of Positions	676
Material	Stainless Steel
Inner Dimension	1.024" L x 1.024" W (26.00mm x 26.00mm)

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BGA0034-S Datasheet PDF

BGA0034-S

Data sheet

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