APA503-00-008
| Manufacturer Part Number | APA503-00-008 |
|---|---|
| Manufacturer | Artesyn Embedded Power |
| Detailed Description | STUD MTG SOLDER FOR HEATSINK LP |
| Package | |
| In Stock | 4409 pcs |
| Data sheet | Cylindrical Battery Holders |
Reference Price (In US Dollars)
Delivery Time
Components-House.com is a Reliable Stocking Distributor of Electronic Parts. We specialize in all Artesyn Embedded Power series electronic components. We have 4409 pieces of Artesyn Embedded Power APA503-00-008 in stock available now. Request a quote from electronics components distributor at Components-House.com, our sales team will contact you within 24 hours.
RFQ Email: info@Components-House.net
RFQ Email: info@Components-House.net
Specifications
| Product Attribute | Attribute Value |
|---|---|
| Series | AMPSS® |
| For Use With/Related Products | AMPSS® |
| Product Attribute | Attribute Value |
|---|---|
| Accessory Type | Mounting Kit |
Recommended Products
-
APA600-BGG456
IC FPGA 356 I/O 456BGAMicrochip Technology -
APA503-00-002
STUD MTG SOLDER FOR HEATSINKArtesyn Embedded Power -
APA600-BG456M
IC FPGA 356 I/O 456BGAMicrochip Technology -
APA501-80-005
HEATSINK (80) 115X59X37MM VERTArtesyn Embedded Power -
APA502-80-001
PAD THERMAL SIZE80 FOR AMPSS MODArtesyn Embedded Power -
APA501-80-004
HEATSINK (80) 115X59X22.5MM HORZArtesyn Embedded Power -
APA600-CGS624B
IC FPGA 440 I/O 624CCGAMicrochip Technology -
APA504-00-001
SOCKET SPRING(20-CONTROL/15-PWR)Artesyn Embedded Power -
APA600-BGG456I
IC FPGA 356 I/O 456BGAMicrochip Technology -
APA502-60-001
PAD THERMAL SIZE60 FOR AMPSS MODArtesyn Embedded Power -
APA503-00-001
STUD MTG TAPPED FOR HEATSINKArtesyn Embedded Power -
APA600-BG456I
IC FPGA 356 I/O 456BGAMicrochip Technology -
APA600-BGG456M
IC FPGA 356 I/O 456BGAMicrochip Technology -
APA501-80-006
HEATSINK (80) 115X59X37MM HORZArtesyn Embedded Power -
APA501-80-003
HEATSINK (80) 115X59X22.5MM VERTArtesyn Embedded Power -
APA600-CGS624M
IC FPGA 440 I/O 624CCGAMicrochip Technology -
APA503-00-007
STUD MTG TAPPED FOR HEATSINK LPArtesyn Embedded Power -
APA501-80-007
HEATSINK (80)115.6X89X12MM LOPROArtesyn Embedded Power -
APA600-BG456
IC FPGA 356 I/O 456BGAMicrochip Technology -
APA600-CQ208B
IC FPGA 158 I/O 208CQFPMicrochip Technology